| 摘要 |
PROBLEM TO BE SOLVED: To provide the treatment method of a copper surface which assures strength of adhesion between a copper surface and an insulating resin without forming irregularities exceeding 1,000 nm on the copper surface, and can improve various kinds of reliability, and a wiring board subjected to the above treatment. SOLUTION: The treatment method of the copper surface includes: a step of discretely forming a metal nobler than copper on the copper surface; a step of forming copper oxide on the copper surface by oxidizing the metal with an alkaline solution including an oxidizing agent; a step of dissolving the copper oxide with an acidic solution; a step of subjecting the copper surface again to oxidation treatment with an alkaline solution including an oxidizing agent to form the copper oxide on the surface; and a step of subjecting the copper surface to reduction treatment with the alkaline solution including a reducing agent to form metal copper. These steps are successively performed in this order. COPYRIGHT: (C)2009,JPO&INPIT
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