发明名称 FILM-FORMING APPARATUS AND FILM-FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a film-forming apparatus which can continuously form a film having high adhesiveness and superior film quality, and to provide a film-forming method therefor. SOLUTION: The film-forming apparatus is directed at forming a predetermined film on a substrate while transporting the long substrate through a predetermined path in a vacuum, and comprises: a removing section for removing dirt on the surface to be film-formed thereon, by bringing an adhesive body in contact with the surface to be film-formed of the substrate while transporting the substrate; a surface-activating section for activating the surface to be film-formed of the substrate, from which the dirt has been removed in the removing section; and a film-forming section for forming the film on the surface to be film-formed of the substrate, which has been activated in the surface-activating section, by using a gas phase film-forming method. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084642(A) 申请公布日期 2009.04.23
申请号 JP20070256153 申请日期 2007.09.28
申请人 FUJIFILM CORP 发明人 ONODERA DAISUKE;FUJINAWA ATSUSHI
分类号 C23C14/02;C23C14/56;C23C16/44;C23C16/54 主分类号 C23C14/02
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