发明名称 PHENOLIC RESIN COMPOSITION, PHENOLIC RESIN MOLDING MATERIAL, AND ITS CURED MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a phenolic resin composition and phenolic resin molding material cured at high speed and having satisfactory thermal stability upon injection molding, and to provide its cured product. SOLUTION: The phenolic resin composition contains a novolac phenolic resin, a polyacetal resin, a cationic curing promoter and a resol resin having at least one dimethylene ether bond in one molecule. The phenolic resin molding material contains the phenolic resin composition and a filler. The cured material is formed by curing the phenolic resin composition or the phenolic resin molding material. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009084358(A) 申请公布日期 2009.04.23
申请号 JP20070254102 申请日期 2007.09.28
申请人 SUMITOMO BAKELITE CO LTD 发明人 MIYAKE SUMIYA;KOHARA SHIGEYOSHI
分类号 C08L61/06;C08K3/00;C08K5/42;C08L59/00 主分类号 C08L61/06
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