发明名称 |
PHENOLIC RESIN COMPOSITION, PHENOLIC RESIN MOLDING MATERIAL, AND ITS CURED MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic resin composition and phenolic resin molding material cured at high speed and having satisfactory thermal stability upon injection molding, and to provide its cured product. SOLUTION: The phenolic resin composition contains a novolac phenolic resin, a polyacetal resin, a cationic curing promoter and a resol resin having at least one dimethylene ether bond in one molecule. The phenolic resin molding material contains the phenolic resin composition and a filler. The cured material is formed by curing the phenolic resin composition or the phenolic resin molding material. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009084358(A) |
申请公布日期 |
2009.04.23 |
申请号 |
JP20070254102 |
申请日期 |
2007.09.28 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
MIYAKE SUMIYA;KOHARA SHIGEYOSHI |
分类号 |
C08L61/06;C08K3/00;C08K5/42;C08L59/00 |
主分类号 |
C08L61/06 |
代理机构 |
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代理人 |
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地址 |
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