| 摘要 |
PROBLEM TO BE SOLVED: To form fine wirings on a substrate by using an ink jet method, with respect to a manufacturing method of an electronic device provided with a substrate that has a solid shape. SOLUTION: The substrate 1 has a cylindrical base and a resin film wound around the base, and the resin film has recessed and projected portions on its surface. While the substrate 1 is being rotated on its lengthwise axis, recessed portions are coated with ink by the ink jet method and then are heated to form seed layers. Then a conductive film is formed on each seed layer by a plating method; and the coating with the ink is carried out, while confirmed through a color CCD camera, and is, preferably stopped, when a desired spot is not coated with ink. COPYRIGHT: (C)2009,JPO&INPIT
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