| 摘要 |
PROBLEM TO BE SOLVED: To keep the wafer quality high, thus handling the wafer easily. SOLUTION: The wafer handling method takes a wafer 31 out of, or puts it into, a wafer storage 10 that has a peripheral portion outside a peripheral edge of the wafer 31, a plurality of placing parts having an inclined plane extending obliquely downward toward a radial inner side of the wafer 31 from a position lower than a top surface of the peripheral portion and placing the wafer 31 by contacting its peripheral edge at a position lower than the top surface of the peripheral portion at the inclined plane, and a notch 23 located between mutually adjacent placing parts in an inner peripheral side of the peripheral portion, which is in the radial outer side of the wafer 31 compared to the placing parts and is lower than the placing height of the wafer 31, wherein the wafer 31 is held, while being stored in the wafer storage 10, by contacting its outer periphery from the notch 23, thus taking it out of the wafer storage 10. COPYRIGHT: (C)2009,JPO&INPIT
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