| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a novel RFID tag installed irrespective of a conductive object or a nonconductive object without shortening a communication distance, forming no protrusion caused by an IC chip on the surface of the RFID tag to eliminate a risk of damaging the IC chip by impact or the like and moreover attaining printing by a label printer. <P>SOLUTION: The method for manufacturing the RFID tag comprises processes for forming a cavity between an upper die and a lower die and injecting a dielectric material resin in the cavity to form a dielectric substrate, and prior to the injection of the resin, arranging a conductor foil in a recess of the lower die and arranging a film base material formed with a conductor pattern, with the IC chip placed in a recess of the upper die in a state of facing the cavity side, to form a conductor pattern on one main surface of the dielectric substrate and a grounding conductor pattern on the other main surface of the dielectric substrate simultaneously with the formation of the dielectric substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
