| 摘要 |
A method for producing a multilayered wiring substrate includes forming a lyophobic area on a first conductive layer, forming an insulating layer with an opening portion on the first conductive layer by applying a functional liquid containing an insulating layer forming material on a periphery of the lyophobic area, laminating the first conductive layer and a second conductive layer via the insulating layer, and electrically connecting the first and the second conductive layers to each other via the opening portion formed in the insulating layer. In the method, when forming the insulating layer, the functional liquid is applied such that an angle of a portion of the functional liquid in contact with the lyophobic area becomes larger than a forward contact angle of the functional liquid, thereby allowing a position of the portion of the functional liquid in contact with the lyophobic area to move inside the lyophobic area to form the opening portion having an opening size smaller than a size of the lyophobic area.
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