发明名称 |
Techniques For Forming Solder Bump Interconnects |
摘要 |
Interconnects are formed on attachment points of a wafer by performing several steps. A plurality of cavities having a predetermined shape is formed in a semiconductor substrate. These cavities are then filled with an interconnect material to form the interconnects. The interconnects are subsequently attached to the attachment points of the wafer. |
申请公布号 |
US2009072392(A1) |
申请公布日期 |
2009.03.19 |
申请号 |
US20070856831 |
申请日期 |
2007.09.18 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DANG BING;GRUBER PETER A.;GUERIN LUC;PATEL CHIRAG S. |
分类号 |
H01L23/52;H01L21/44 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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