| 发明名称 |
Soldering method and structure manufactured by using this soldering method |
| 摘要 |
<p>A structure includes a substrate; and an electrode joined to the substrate by soldering. The electrode has a cavity which has an opening to a joining plane located where the electrode and the substrate are joined. The joining plane is circular.
</p> |
| 申请公布号 |
EP1696715(A3) |
申请公布日期 |
2009.03.18 |
| 申请号 |
EP20060101568 |
申请日期 |
2006.02.13 |
| 申请人 |
MITSUBISHI HEAVY INDUSTRIES, LTD. |
发明人 |
OKAZAKI, YOSHIMI;YAMAZAKI, HIROYUKI |
| 分类号 |
H05K3/34;H05K1/14;H05K7/14 |
主分类号 |
H05K3/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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