发明名称 GLASS COMPOSITION FOR SEALING
摘要 PROBLEM TO BE SOLVED: To obtain a glass composition for sealing having a low thermal expansion coefficient and good flowability at a temperature of not higher than 600°C while satisfying environmental requirements in recent years. SOLUTION: The glass composition for sealing contains, by mass, 60 to <77% of Bi<SB>2</SB>O<SB>3</SB>, 5 to 20% of B<SB>2</SB>O<SB>3</SB>, 3 to 15% of ZnO, and >1 to 7% of SiO<SB>2</SB>as glass components, and has a thermal expansion coefficient of≤100×10<SP>-7</SP>/°C within a temperature range of 30-300°C. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009046380(A) 申请公布日期 2009.03.05
申请号 JP20080116597 申请日期 2008.04.28
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 ISHIHARA KENTARO
分类号 C03C8/04;H01J61/30 主分类号 C03C8/04
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