发明名称 PACKAGE STRUCTURE FOR MICRO-SENSOR
摘要 The invention discloses a package structure for a micro-sensor including a micro-cantilever for capturing a chemical substance. The package structure, according to the invention, includes a first substrate, a second substrate, and a casing. The first substrate thereon forms a processing circuit. The micro-sensor is bonded to a first upper surface of the first substrate and is electrically connected to the processing circuit capable of outputting a signal relative to the chemical substance sensed by the micro-sensor. The second substrate has a formed-through aperture. The second substrate is bonded to the first substrate such that the micro-sensor is disposed in the formed-through aperture. The casing is bonded to the second substrate and includes a reaction chamber in which the micro-cantilever is installed and a fluid containing the chemical substance flows into.
申请公布号 US2009057789(A1) 申请公布日期 2009.03.05
申请号 US20080186388 申请日期 2008.08.05
申请人 HUANG LONG SUN;CHIOU YUNG SHAN;LIN KUAN YI;YEN YI KUANG;HUNG CHIA MING 发明人 HUANG LONG SUN;CHIOU YUNG SHAN;LIN KUAN YI;YEN YI KUANG;HUNG CHIA MING
分类号 H01L29/00 主分类号 H01L29/00
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