| 摘要 |
Provided is a light emitting device wherein a void is prevented from being generated in a sealing resin (50), which seals an LED chip (1) by being applied in a space surrounded by an optical member (60) and a mounting board (20). In the light emitting device, alignment accuracy of the optical member is improved and generation of solder failure at an external connecting electrode section arranged outside a color conversion member (70) is prevented. On the outer side of the optical member (60) on an upper surface of the mounting board (20), an annular ring gate (27) is arranged to be protrude. The ring gate (27) defines the position of the color conversion member (70), and prevents the sealing resin from flowing out to the external connecting electrode section by damming the sealing resin flowed out from the space. Furthermore, a plurality of centering claws (27b) are arranged on the inner circumference surface of the ring gate (27) and the position of the optical member (70) is defined. |
