发明名称 ETCHING PROCESSING METHOD
摘要 The etching processing method is characterized in that, when performing an etching processing on a resin member by using a desmear liquid containing an alkaline permanganate etching liquid, the etching processing is performed by dipping the resin member into the desmear liquid of which an etching rate for a resin forming the resin member is adjusted by using at least one of an accelerator for accelerating the etching rate of the desmear liquid and a suppressor for suppressing the etching rate.
申请公布号 US2009057270(A1) 申请公布日期 2009.03.05
申请号 US20080196467 申请日期 2008.08.22
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 NAKAMURA NORIKAZU
分类号 B44C1/22 主分类号 B44C1/22
代理机构 代理人
主权项
地址