发明名称 LED LAMP, AND LED LAMP MODULE
摘要 <P>PROBLEM TO BE SOLVED: To achieve an LED lamp module in which the connection state between an LED lamp using a substrate made of ceramics and a wiring substrate is improved. <P>SOLUTION: The LED lamp module 10 is composed of an LED lamp 100 and a wiring substrate 150. The LED lamp 100 is disposed in a recess 151 formed in the wiring substrate 150. A ceramic substrate 101 of the LED lamp 100 has a two-layer structure formed of an upper layer 104 and a lower layer 105, and an external connection terminal 112 is formed on a side surface 104a of the upper layer 104. A through hole 111 is formed to penetrate the ceramic substrate 101, and a heat dissipation plate 113 is formed all over the rear surface of the lower layer 105. A plate spring-shaped terminal 153 is formed in the vicinity of the recess 151 of the wiring substrate 150. The plate spring-shaped terminal 153 is pressed against and is in contact with the external connection terminal 112. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009048915(A) 申请公布日期 2009.03.05
申请号 JP20070215252 申请日期 2007.08.21
申请人 TOYODA GOSEI CO LTD 发明人 SHIMONISHI SHOTA;TAJIMA HIROYUKI;YAMAGUCHI TOSHIO
分类号 F21V23/00;F21V29/00;H01L33/56;H01L33/62;H01L33/64 主分类号 F21V23/00
代理机构 代理人
主权项
地址