发明名称 |
LED LAMP, AND LED LAMP MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To achieve an LED lamp module in which the connection state between an LED lamp using a substrate made of ceramics and a wiring substrate is improved. <P>SOLUTION: The LED lamp module 10 is composed of an LED lamp 100 and a wiring substrate 150. The LED lamp 100 is disposed in a recess 151 formed in the wiring substrate 150. A ceramic substrate 101 of the LED lamp 100 has a two-layer structure formed of an upper layer 104 and a lower layer 105, and an external connection terminal 112 is formed on a side surface 104a of the upper layer 104. A through hole 111 is formed to penetrate the ceramic substrate 101, and a heat dissipation plate 113 is formed all over the rear surface of the lower layer 105. A plate spring-shaped terminal 153 is formed in the vicinity of the recess 151 of the wiring substrate 150. The plate spring-shaped terminal 153 is pressed against and is in contact with the external connection terminal 112. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009048915(A) |
申请公布日期 |
2009.03.05 |
申请号 |
JP20070215252 |
申请日期 |
2007.08.21 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
SHIMONISHI SHOTA;TAJIMA HIROYUKI;YAMAGUCHI TOSHIO |
分类号 |
F21V23/00;F21V29/00;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
F21V23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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