发明名称 METHOD FOR DIVIDING PACKAGE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To attain a cutting work which secures necessary irreducible precision even when there is angle deviation among division prospective lines while securing high throughput by dual cutting. SOLUTION: Pairs A to D of division projected lines for cutting with a pair of cutting blades are determined in units of division projected lines S1 to S10 within a range wherein an amountΔθof deviation in angle is less than a preset allowed valueΔ, and dual cutting is carried out in units of the pairs A to D of division projected lines to perform the cutting wherein the necessary irreducible precision is secured with respect to deviations in angle between the division projected lines S1 to S10 and actual cutting lines even if the division projected lines S1 to S10 deviate in angle while securing high throughput by dual cutting. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009049303(A) 申请公布日期 2009.03.05
申请号 JP20070216053 申请日期 2007.08.22
申请人 DISCO ABRASIVE SYST LTD 发明人 SAWAKI SATOSHI;NEGISHI KATSUHARU
分类号 H01L21/301 主分类号 H01L21/301
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