DEVICE AND METHOD FOR REMOVING SILICON PARTICLE OF WAFER

摘要

A device and method for removing silicon particle of sawing machine for semiconductor package are provided to prevent the silicon dust particle generated in the wafer sawing by jetting the water while producing the cavitation on the wafer. The nozzle-form air curtain bar(122) is installed at one side of the wafer alignment part(120) of the wafer sawing machine. The solvent storage(124) stores the mixture in which the surfactant solution and water are mixed. The air pressure providing part(128) provides the air pressure within the solvent storage. The solenoid valve is installed on the air pressure providing line(130) between the solvent storage and the air pressure providing part. The mixture offer line(134) is connected between the solvent storage and the nozzle-form air curtain bar.