SYSTEM IN PACKAGE OF PROTECTING NOISE TRANSFER BETWEEN STACKED DIES

摘要

A system in package of protecting noise transfer between stacked dies is provided to improve the electrical characteristic while implementing the miniaturization. A system in package(100) comprises a semiconductor substrate(110), the first die(130), the high conductive layer(150), and the second die(170). The semiconductor substrate has the grounding pad(112). The first die is arranged on the semiconductor substrate. The high conductive layer is located on the surface of the first die and is electrically connected with the grounding pad. The second die is arranged on the high conductive layer. The high conductive layer prevents the interference between the first and second dies. The high conductive layer is the same material as the first and second dies.