| 摘要 |
A semiconductor device is provided to reduce unevenness of the overlapped part between an antenna and an element. A chip comprises a semiconductor element layer, a conductive resin and a sealing layer. The semiconductor element layer includes a thin film transistor. The conductive resin is formed on the semiconductor element layer. The sealing layer covers the semiconductor device layer and conductive resin, and has the fibrous material in which the organic resin is dipped. The antenna(317) is a concave part(322), and is electrically connected to the thin film transistor through the conductive resin. The chip is filled in the concave part. The sealing layer has the thickness of 10 micrometers to 100 micrometers. |
