| 摘要 |
PROBLEM TO BE SOLVED: To easily secure the flatness of a resin layer in a semiconductor device having a multilayer wiring structure. SOLUTION: In the semiconductor device comprising at least a semiconductor substrate 11 with an integrated circuit, a first resin layer 12 provided on the semiconductor substrate 11, a first wiring layer 13 provided on the first resin layer 12, a second resin layer 14 having an opening 15 for exposing a part of the first wiring layer 13 and covering the first resin layer 12 and the first wiring layer 13, and a second wiring layer 16 provided on the second resin layer 14 and conducted with the first wiring layer 13 through the opening 15, a structure 18 having the almost same height as the first wiring layer 13 is disposed over the entire area of the semiconductor substrate 11 excluding the vicinity of the first wiring layer 13. COPYRIGHT: (C)2009,JPO&INPIT
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