Method and Device for Encapsulating Electronic Components With a Conditioning Gas

摘要

The invention relates to a method for encapsulating electronic components in a mould by the processing steps of: A) placing the electronic component for encapsulating in a mould cavity, and B) feeding an encapsulating material to the mould cavity, wherein at least a part of the mould surface defining the mould cavity is brought into contact with a conditioning gas containing a decreased oxygen concentration relative to the atmosphere. The invention also relates to a device for encapsulating an electronic component, in particular a semiconductor, with encapsulating material.