METHOD FOR JOINING SILICON BASE MATERIALS, LIQUID DROPLET DELIVERY HEAD, LIQUID DROPLET DELIVERY APPARATUS, AND ELECTRONIC DEVICE

摘要

This invention provides a method for joining silicon base materials, comprising providing a base material formed of silicon, etching the surface of the base material with a hydrofluoric acid-containing solution to impart an Si-H bond to the surface of the base material and thus to prepare a first silicon base material. Next, a laser beam is applied to the surface of the first silicon base material to selectively cut the Si-H bond and to allow an unbonded hand to expose. Next, a second silicon base material with an unbonded hand of silicon exposed on its surface is provided. The surface of the first silicon base material is brought into intimate contact with and bonded to the surface of the second silicon base material.