ELECTRONIC DEVICE MANUFACTURING METHOD

摘要

An electronic device manufacturing method includes a step of arranging a resin composition containing a filler and a photocuring resin to cover a mark, on a substrate (transparent substrate (13)) whereupon the mark is formed or on the electronic component (a light receiving section (11) and a base substrate (12) having the light receiving section (11) arranged thereon) whereupon the mark is formed; a step of aligning a mask of an exposure apparatus with the substrate or the electronic component whereupon the resin composition is arranged; a step of leaving in a prescribed region the resin composition by development, by selectively irradiating the resin composition with light through the mask; and a step of adhering the substrate and the electronic component through the resin composition by arranging them to face each other. In the step of aligning the mask of the exposure apparatus with the substrate or the electronic component whereupon the resin composition is arranged, the mark is detected by using light having a wavelength 1.5 times or more the average grain diameter of the filler contained in the resin composition.