| 摘要 |
<p>The present disclosure relates to a method of manufacturing an electronic device in which a plurality of first bumps (110) serving as external connection terminals are formed on a conductive pattern (106). The method includes: (a) forming a second bump (104) having a projection portion (104A) on an electrode pad (103) formed on a substrate (101); (b) forming an insulating layer (105) on the substrate (101); (c) exposing a portion of the projection portion (104A) from an upper surface of the insulating layer (105); (d) forming a flat stress absorbing layer (120) in a bump providing area (135), in which the first bumps (110) are provided, on the insulating layer; (e) forming a first conductive layer (107) on the insulating layer (105) and the stress absorbing layer (120) and the exposed portion of the projection portion (104A); (f) forming a second conductive layer (108) by an electroplating using the first conductive layer (107) as a power feeding layer; (g) forming the conductive pattern (106) by patterning the second conductive layer (108); and (h) forming the first bumps (110) on the conductive pattern (106) formed on the stress absorbing layer (120).</p> |
