Electronic component package including joint material for higher heat conductivity

摘要

An electronic component (21) is mounted on the surface of a printed wiring board (14). A heat conductive member (15) is received on the surface of the electronic component (21). A joint material (26) is interposed between the electronic component (21) and the heat conductive member (15). The joint material (26) is made of material containing Ag in a range exceeding 3wt% and In. The inventors have demonstrated that voids decrease at the boundary between the joint material (26) and the electronic component (21) as well as at the boundary between the joint material (26) and the heat conductive member (15) as the content of Ag increases in the overall weight of the joint material (26). The joint material (26) is allowed to enjoy a higher heat conductivity as compared with a conventional solder material. The joint material (26) allows the heat conductive member to efficiently receive heat from the electronic component (21).