| 摘要 |
The invention relates to a waveguide system for distributing high-bandwid th signals in a multilayer circuit carrier. The waveguide system comprises a t least one coplanar waveguide (2) and one or more ground wires (3, 4). The coplanar waveguide (2) is disposed with the ground wires (3, 4) associated t herewith between at least two insulating layers (5, 6) of the circuit carrie r. The surface of the two insulating layers oriented away from the plane of the waveguide (2) has electrically conductive layers (7, 8). Electrically co nductive plated through-holes (9, 10) extend along the waveguide (2) substan tially perpendicular to the plane of the waveguide. The ground wires (3, 4), the electrically conductive layers (7, 8), and the plated through-holes (9, 10) are electrically connected to ground potential. The waveguide system se rves particularly for the three-dimensional distribution of high-bandwidth s ignals.
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