| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stack semiconductor package assembly that can realize a semiconductor device density enlarging bottom package. <P>SOLUTION: A substrate of a semiconductor package is provided with an aperture that is sized to accommodate a mold cap of a bottom package to which a package to be stacked using mutual connections of solder balls Z in the circumferential edge is set. <P>COPYRIGHT: (C)2008,JPO&INPIT |
