| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve sufficient solder wickings in a printed wiring board or the like where an electronic component is mounted. <P>SOLUTION: The printed wiring board 10A includes: plural layers of conductive patterns 101, 102, 103 and 104 that spread over the surface or into the inside of the printed wiring board 10A and that are held to an identical potential at the operation of the circuit; and a through-hole 11 into which a lead wire 21 is inserted, wherein the electronic component 20 has the lead wire 21 being a wire-like connection terminal. At least one of the first through-hole 11 among through-holes 11 has a conductor film 111 on an internal surface of the first through-hole 11, wherein the conductor film 111 is configured by only coming into contact with a conductor pattern 101 on a part of a layer among the plural layers of conductor pattern 101, 102, 103 and 104. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
