发明名称 METHOD OF FABRICATING TWO-STEP SELF-ALIGNED CONTACT
摘要 A method of fabricating a self-aligned contact is provided. A first dielectric layer is formed on a substrate having a contact region therein. Next, a lower hole corresponding to the contact region is formed in the first dielectric layer. Thereafter, a second dielectric layer is formed on the first dielectric layer, and then an upper hole self-aligned to and communicated with the lower hole is formed in the second dielectric layer, wherein the upper hole and the lower hole constitute a self-aligned contact hole. Afterwards, the self-aligned contact hole is filled with a conductive layer.
申请公布号 US2008230917(A1) 申请公布日期 2008.09.25
申请号 US20070686740 申请日期 2007.03.15
申请人 UNITED MICROELECTRONICS CORP. 发明人 CHOU LING-CHUN;CHEN MING-TSUNG;TSAO PO-CHAO
分类号 H01L23/48 主分类号 H01L23/48
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