APPARATUS FOR CHEMICAL MECHANICAL POLISHING

摘要

Chemical mechanical polishing equipment is provided to improve the product yield by preventing a chemical mechanical polishing process from being abnormally performed due to separation of a conditioner head. Chemical mechanical polishing equipment comprises a platen(120) and a first polishing pad(130) for covering the upper portion of the platen. A second polishing pad(140) presses a wafer(W) above the first polishing pad so that the wafer is polished by the first polishing pad. A pad conditioner(150) has a conditioner head(152) for sweeping at one side of the first polishing pad while polishing the surface of the first polishing pad by a predetermined level. A clean cup(160) is formed at one side of the platen to clean the conditioner head. A sensor(170) detects if the conditioner head is separated from the pad conditioner. A controller determines if the conditioner head is separated from the pad conditioner based on a detection signal from the sensor and outputs an interlock control signal according to the determination result.