SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND OPTICAL PICKUP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of miniaturizing an entire size and especially capable of reducing the length of a pair of opposing sides in four sides of a nearly rectangular package.

SOLUTION: In the semiconductor device 1, a semiconductor element 10 is mounted on the nearly rectangular package 50. First ribs 70, 70 are provided at a pair of opposing edges on a mount surface 62 so that the first ribs 70, 70 project, and the edge of a lid body 90 is placed on an upper surface 70b and is fixed by an adhesive 85. A dam 80 is provided at the edge of the first rib upper surface 70b, and the adhesive 85 continues from the side of the lid body 90 to the dam 80.

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