发明名称 SYSTEM AND METHOD FOR COMPENSATING FOR VOLTAGE IN INTEGRATED CIRCUIT CHIP USING DIVIDED ELECTRIC POWER PLANE
摘要 PROBLEM TO BE SOLVED: To provide a system and a method for increasing a voltage to be supplied in a predetermined region in an integrated circuit. SOLUTION: The system includes an integrated circuit chip. A power source supply network is connected to the integrated circuit chip and includes a plurality of metal wire layers and a plurality of via layers. An electric power plane is connected to the power source supply network and divided into two or more portions individually connected to distinct power source supply networks. The power source is connected to a portion of the electric power plane and configured so as to apply a first voltage to a first portion of the portion and also apply a second voltage, different from the first voltage, to a second portion of the portion. The first and second voltages are selected so as to generate a substantially uniform voltage across the integrated circuit chip. The metal wire layers are arranged alternately with the vias. The electric power supply network further includes a contact layer that connects the uppermost metal layer of the metal layers to the electric power plane. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227500(A) 申请公布日期 2008.09.25
申请号 JP20080060259 申请日期 2008.03.10
申请人 TOSHIBA CORP 发明人 TAKASE SATORU
分类号 H01L21/82;H01L21/3205;H01L21/822;H01L23/52;H01L27/04 主分类号 H01L21/82
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