| 摘要 |
A chip hermetic package device includes a substrate, a chip, a hermetic lid, a hermetic material and a post. The height of the post is larger than the thickness of the hermetic material. A method for producing a chip hermetic package includes the steps of: mounting the chip on the substrate; disposing the post and the hermetic material between the substrate and the hermetic lid; disposing the hermetic lid on the substrate to form a chamber, the post supporting the hermetic lid on the substrate to form an air passage; and performing a sealing step in an atmosphere of inert gas. The present invention utilizes the post to form the air passage between the substrate and the hermetic lid. Therefore, only is the sealing step performed in the atmosphere of nitrogen, and present invention needs a reduced number of equipment. Therefore, the present invention has a low cost, simplifies the packaging process and improves efficiency.
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