| 摘要 |
PROBLEM TO BE SOLVED: To securely constrain a minute structure, and to transfer it to a mounting board without damaging the minute structure in processes of constraint, transfer and release, and without the need of a complicated control system. SOLUTION: A transfer method of the minute structure is provided with a resin including process for surrounding the minute structures (30, 40, 50, 60, 70 and 80) on a glass substrate (2) with resin and including them in a resin curing object (6) having elastic modulus lower than that of the minute structure, a transfer process for constraining the resin curing object by a transfer device and transferring the resin curing object to the mounting board (7) as a carrier, and a carrier separating process for moving the carrier, separating the carrier from the minute structure and leaving the minute structure on the mounting board. COPYRIGHT: (C)2008,JPO&INPIT
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