发明名称 |
LEADFRAME OF A LEADLESS FLIP-CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A leadframe of a leadless flip-chip package includes a plurality of inner leads, a nonconductive ink layer and a solder mask layer. The inner leads have a plurality of bump-connecting terminals, a plurality of outer terminals and a plurality of redistribution lead portions. A half-etched recession is formed on lower surfaces of the redistribution lead portions, and is filled with the non-conductive ink layer. The non-conductive ink layer fixes the redistribution lead portions onto the bump-connecting terminals. The solder mask layer is easily formed on the non-conductive ink layer and covers the inner leads.
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申请公布号 |
US2008093717(A1) |
申请公布日期 |
2008.04.24 |
申请号 |
US20070943655 |
申请日期 |
2007.11.21 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
HUANG YAO-TING;CHANG CHIH-HUANG |
分类号 |
H01L23/06;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/31;H01L23/498;H01L25/065 |
主分类号 |
H01L23/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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