| 摘要 |
PURPOSE: An LED package is provided to prevent generation of a void by discharging an encapsulating material to the outside of a package mold through an exhausting part formed between the main part of a lens settling part and a lens. CONSTITUTION: A package mold(120) stores the part of a lead frame(110) inside and forms a molding material injection space(123). A lens settling part(125) is formed into a concavo-convex part inside the package mold of the upper part of the molding material injection space. An LED chip(130) is mounted in the lead frame inside the package mold. An exhausting part(127) is formed by separating the main part of the lens settling part from the lens. A sealing agent is arranged between the bottom surface of the lens and the package mold.
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