Polyamide moulding material for lacquer-free ductile housing with highly reflective surface

摘要

Polyamide molding material (A) comprises: (a) 95-5 wt.% of an amorphous copolyamide with a bis(methyl-para-aminocyclohexyl)methane, isophthalic acid (MACMI) proportion of 5-95 wt.%, bis(methyl-para-aminocyclohexyl)methane, terephthalic acid (MACMT) proportion of 0-90 wt.% and lactam (LC)12 proportion of 5-60 wt.%; (b) 5-95 wt.% of an amorphous, microcrystalline or partially crystalline polyamide; (c) 1-30 wt.% of at least one impact modifier; and (d) 0-80 wt.% of at least one additive. Polyamide molding material (A) comprises: (a) 95-5 wt.% of an amorphous copolyamide of formula (polyamide (PA) MACMI/MACMT/12) with a MACMI proportion in the copolyamide of 5-95 wt.%, MACMT proportion of 0-90 wt.% and LC12 proportion of 5-60 wt.%; (b) 5-95 wt.% of an amorphous, microcrystalline or partially crystalline polyamide of formula (PA(MACMX)x/(bis(p-aminocyclohexyl)methane (PACM)Y1)y/(meta-xylylene diamine (MXD)U1)u/(LCZ)z); (c) 1-30 wt.% of at least of one impact modifier; and (d) 0-80 wt.% of at least of one additive. x, y, u, z : 0-100 wt.%; X, Y1, U1 : dicarboxylic acid (DC) comprising DC4, DC6, DC9, DC10, DC11, DC12, DC13, DC14, DC15 to DC36; and LCZ : lactams or corresponding amino carboxylic acids comprising LC4, LC6, LC11 or LC12.