| 摘要 |
PURPOSE: A wiring board and a manufacturing method thereof are provided to easily form a copper pattern inside a via hole by filling a copper solution inside the via hole through a printing method. CONSTITUTION: A protective film is attached on a first surface of a substrate(10). A plurality of via holes(11) are formed through the substrate and the protective film. A metal layer is formed in a second surface of the substrate. A copper solution is filled within the via hole. The copper pattern is formed inside the via hole by drying and annealing the copper solution. The first surface of the substrate is exposed by eliminating the protective film. A circuit part is formed by patterning the metal layer.
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