发明名称 |
Method for making an interconnect structure and low-temperature interconnect component recovery process |
摘要 |
<p>A method is provided for making an interconnect structure. The method includes applying a low-temperature removable layer 26 and adhesive layer 16 to an electronic device 18 or to a base insulative layer; and securing the electronic device to the base insulative layer using the adhesive layer.</p> |
申请公布号 |
EP2184776(A1) |
申请公布日期 |
2010.05.12 |
申请号 |
EP20080168412 |
申请日期 |
2008.11.05 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
FILLION, RAYMOND ALBERT;MILLS, RYAN CHRISTOPHER |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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