发明名称 |
HÄRTBARE SILIKONZUSAMMENSETZUNG UND ELEKTRONIKBAUTEIL |
摘要 |
<p>A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for an epoxy resin; (C) a thermally conductive metal powder; and (D) a thermally conductive nonmetal powder; exhibits low viscosity, excellent handleability and curability and, when cured, forms a cured body of flexibility, low specific gravity, and excellent thermal conductivity. An electronic component sealed or adhesively bonded with use of a cured body obtained by curing the aforementioned composition provides high reliability.</p> |
申请公布号 |
DE602007005661(D1) |
申请公布日期 |
2010.05.12 |
申请号 |
DE20076005661T |
申请日期 |
2007.08.23 |
申请人 |
DOW CORNING TORAY CO. LTD. |
发明人 |
MORITA, YOSHITSUGU;ISSHIKI, MINORU;KATO, TOMOKO |
分类号 |
C08L83/04;C08G77/04;C08K3/08;C08K9/06;C09C1/40;C09C3/12 |
主分类号 |
C08L83/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|