发明名称 APPARATUS FOR ASSEMBLING SUBSTRATES AND METHOD FOR ASSEMBLING SUBSTRATES
摘要 PURPOSE: A device and a method for bonding substrates are provided to easily separate a substrate from an adhesive. CONSTITUTION: A substrate separator(120) sprays gas on an upper substrate. The substrate separator separates an adhesive from the upper substrate. A lower substrate which will be combined with the upper substrate is mounted on a lower surface plate(201). A lower chamber(200) is combined with an upper chamber. The lower chamber has a bonding space where the upper substrate is bonded with the lower substrate.
申请公布号 KR20100048051(A) 申请公布日期 2010.05.11
申请号 KR20080107044 申请日期 2008.10.30
申请人 ADP ENGINEERING CO., LTD. 发明人 HWANG, JAE SEOK
分类号 G02F1/13;H01L21/20 主分类号 G02F1/13
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