发明名称 |
APPARATUS FOR ASSEMBLING SUBSTRATES AND METHOD FOR ASSEMBLING SUBSTRATES |
摘要 |
PURPOSE: A device and a method for bonding substrates are provided to easily separate a substrate from an adhesive. CONSTITUTION: A substrate separator(120) sprays gas on an upper substrate. The substrate separator separates an adhesive from the upper substrate. A lower substrate which will be combined with the upper substrate is mounted on a lower surface plate(201). A lower chamber(200) is combined with an upper chamber. The lower chamber has a bonding space where the upper substrate is bonded with the lower substrate. |
申请公布号 |
KR20100048051(A) |
申请公布日期 |
2010.05.11 |
申请号 |
KR20080107044 |
申请日期 |
2008.10.30 |
申请人 |
ADP ENGINEERING CO., LTD. |
发明人 |
HWANG, JAE SEOK |
分类号 |
G02F1/13;H01L21/20 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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