| 摘要 |
PURPOSE: A semiconductor device is provided to prevent the tip of a connection tool from contacting to an opening regardless of the area size of an electrode pad. CONSTITUTION: A plurality of wiring layers(13, 15, 17) and a plurality of interlayer insulation layers(12, 14, 16, 18) are formed a stacked wiring part(11). An external connection electrode(17a) is formed on one of the wiring layers. An opening(22) is formed through a semiconductor device layer(7) and the stacked wiring parts. The opening in a concave shape exposes the surface of the external connection electrode. The opening includes a first opening(22a), which is apart from the external connection electrode, and a second opening(22b). The second opening is smaller than the first opening. |
