| 摘要 |
<p>PURPOSE: An apparatus for simultaneously separating and absorbing semiconductor chips is provided to improve the productivity of a bonding machine by reducing a time for separating semiconductor chips from a wafer and bonding the semiconductor chips. CONSTITUTION: A plurality of separating units(140, 160) is approached to the lower side of a wafer. Semiconductor chips are separated from the wafer by the separating units. A plurality of transfer units(100, 130) absorbs and transfers the separated semiconductor chips. The transfer units include a collet and a collet holder. The collet absorbs the semiconductor chips and the collet holder holds the collet. The separating units and the transfer units are simultaneously and vertically move.</p> |
