| 摘要 |
A semiconductor device 1 includes a semiconductor chip 10. Each of the semiconductor chips 10 includes a semiconductor substrate 12, a semiconductor layer 14 and an interconnect layer 16. The semiconductor substrate 12 has a specific resistanceρ1 (first specific resistance). A semiconductor layer 14 is provided on the semiconductor substrate 12. Such semiconductor layer 14 exhibits a specific resistanceρ2 (second specific resistance). The relationship of these specific resistances is:ρ2<ρ1. The interconnect layer 16 is provided on the semiconductor layer 14. An inductor 18 for transmitting and receiving signals with an external element outside the semiconductor chip 10 is provided in the interconnect layer 16.
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