发明名称 |
System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices |
摘要 |
System and method for preventing resin-based adhesive from contacting a substrate to minimize resin bleed-out and contamination. A preferred embodiment comprises a semiconductor device having a die mounted on a substrate, first and second gold surfaces formed on the substrate, a trench formed between the first and second gold surfaces, resin-based adhesive applied to the first gold surface, and a heat sink bonded to the resin-based adhesive.
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申请公布号 |
US7598119(B2) |
申请公布日期 |
2009.10.06 |
申请号 |
US20070716912 |
申请日期 |
2007.03.12 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MARTINEZ SERGIO V.;LEE BOON HOR;ROBINSON KAREN LYNNE |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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