| 摘要 |
PURPOSE: A light emitting diode package for projection system is provided to remarkably improve the photonic efficiency using anti-reflective coating glass lens to protect an LED chip. CONSTITUTION: A light emitting diode package for projection system comprises a package body(11), and an LED chip. An internal space is formed in the package body. The upper part of the package body is opened. An LED chip is mounted on the floor of the package body. The package body includes the socket binding site(12). The socket binding site is formed by the height to be inserted in the top circumference of the body of a package in the socket(30) of the optical engine. |
