| 摘要 |
<p>An LED package is provided with a three-dimensional substrate (12), which has an LED chip (11) mounted thereon and is mounted on a mounting board (20) electrically connected with the LED chip (11); and a plurality of elastic bodies (17) mounted on the mounting board (20) through a solder (21). The elastic bodies (17) maintains a position of the three-dimensional substrate (12) on the mounting board (20) by an elastic force applied from a plurality of outer surfaces facing each other, i.e., outer surfaces of the three-dimensional substrate (12), to inner surfaces.</p> |
