| 摘要 |
PURPOSE: A semiconductor device and a formation method are provided to prevent delay of a process basically by preventing that a laser marking formed on a wafer is not detected. CONSTITUTION: A semiconductor device includes a plurality of recesses(120) and a laser marking(110). The plural recesses are formed at the one-side part of a wafer(100). The laser marking includes a metal material(130) filled in the plural recesses. A method of manufacturing the semiconductor device is comprised of the steps: a recess is formed on one-side part of a circular wafer; the recesses are filled with a metal material; and a thin film is laminated on the wafer in which the recess is formed.
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