METHOD FOR MANUFACTURING MULTI-LAYER SUBSTRATE AND THE MULTI-LAYER SUBSTRATE MANUFACTURED BY THE METHOD

摘要

PURPOSE: A method for manufacturing a multi-layer substrate and the multi-layer substrate of the same are provided to form a seed layer for electroplating without electroless plating. CONSTITUTION: A method for manufacturing a multi-layer substrate is comprised of the steps: a base substrate in which a circuit pattern is formed is prepared(S8); an insulating layer is formed on the base substrate to bury the circuit pattern(S9); a connection hole is formed on the insulating layer(S10); a seed layer is formed through sputtering(S11); a plating layer is formed on the seed layer by electroplating(S12); and the formed plating layer is processed as a predetermined pattern(S14).