| 摘要 |
A semiconductor chip probe is provided to prevent damage due to the impact load generated in the semiconductor chip inspection process by binding the conductive rubber part in the lower part of the lower part plunger. A probe protrusion contacted to the solder ball of the inspection target object is molded on the top of the plunger(7). A cylindrical barrel(8) has the opened either side. A lower part of the top plunger is adopted to the opened either side as described above of the cylindrical barrel. A coil spring(9) is admitted inside barrel and provides the elastic force to the top plunger. A lower part plunger(6) is adopted to the lower part of the cylindrical barrel and is contacted to the contact unit of the circuit board for test. A conductive rubber part(20) is combined in the bottom part of the lower part plunger. A groove is formed on the top of the conductive rubber part, and a protrusion is formed in the lower part of the lower part plunger. The protrusion is combined with the groove. A jaw is formed on top end portion of depression. |
