LEAD SOLDERING SYSTEMOF SEMICONDUCTOR PACKAGE

摘要

A lead soldering system of a semiconductor package is provided to improve soldering quality of a lead by forming a structure for tilting a semiconductor package. A robot apparatus successively transfers a semiconductor package(1) to a flux bath, a pre-heater soldering bath, and a cleaning bath. The robot apparatus includes a plurality of grippers(28) and a lifting carriage(26) which lifts the gripper. A plurality of gripper supporting bars(30) is installed in the lifting carriage in state the grippers are fixed. The gripper supporting bars are tilted with a fixed angle. The gripper supporting bars are swung in order to swing and clean the semiconductor package dipped in the soldering bath.